BioSensor Workshop and Tour Summary
Apr 16, 2013
FlexTech’s 2nd annual workshop on health, safety and biosensor applications drew an audience of 65+ end users, product designers and component suppliers to discuss the latest issues in wearable electronics.

FlexTech Alliance Elects Keith Rollins Chairman of the Board
Feb 19, 2013
DuPont Teijin Films’ Executive Dr. Keith Rollins to Drive Development and Deployment of Technology and Applications for Printed and Flexible Electronics

Flex Conference 2013 Focuses on Multi-Market Applications for Flexible, Printed Electronics
Feb 6, 2013
Printable spacecraft, nano-bio sensors, miles of rolls of efficient solar material and other groundbreaking applications of flexible, printed electronics were featured at the recently concluded 2013 Flex Conference.

FlexTech Alliance Announces 2013 FLEXI Award Winners, Recognizing Accomplishments in Flexible and Printed Electronics
Jan 31, 2013
American Semiconductor, Corning Incorporated, and Plastic Logic were recognized for significant contributions to innovation and R&D. The awards celebrate organizations that are leading development in flexible and printed electronics with innovative and commercially viable products and technologies.

Air Force Award to FlexTech Alliance Will Accelerate Development of New Nano-Bio Devices
Jan 30, 2013
Remote, wireless monitoring of physiological functions and structural performance in real time has long been a goal of many manufacturing industries. Achievement of that goal is now a step closer to reality with the announcement today of an Air Force Research Laboratory (AFRL) award to FlexTech Alliance of San Jose, Calif.

Air Force Award to FlexTech Alliance Will Accelerate Development of New Nano-Bio Devices
Jan 30, 2013
Remote, wireless monitoring of physiological functions and structural performance in real time has long been a goal of many manufacturing industries. Achievement of that goal is now a step closer to reality with the announcement today of an Air Force Research Laboratory (AFRL) award to FlexTech Alliance of San Jose, Calif.

Clemson University and PARC Receive Award from FlexTech Alliance to Transfer Functional Printing from Laboratory to Commercial Scale
Jan 7, 2013
FlexTech Alliance announced an award to the Sonoco Institute at Clemson University and PARC, a Xerox company, to explore the process technology required to scale up and print functional devices using a commercial printing press. The partners will leverage their combined knowledge to enhance U.S. capability and facilitate the development of gravure printing processes.

FlexTech Alliance Partners with 4D Technology to Develop a New Metrology System for Roll-to-Roll Electronics Manufacturing
Dec 19, 2012
Funding development of the in situ metrology system addresses a current shortcoming in roll–to-roll (R2R) electronics manufacturing and will enable new, real time levels of process control and yield enhancement.

Flextech Alliance to Feature Pioneers, Innovators and Integrators at the 2012 Flexible and Printed Electronics Conference and Exhibition
Dec 18, 2012
Keynotes, Agenda, Demonstrations and Workshops Announced
At this 12th annual conference, attendees will gather perspectives from Fortune 500 companies, innovative start-ups and the organizations that are bringing the technology together to create solutions and provide practical applications.

Imprint Energy Receives Award from FlexTech Alliance
Dec 10, 2012
Imprint Energy, Inc. of Alameda, Calif., will undertake a FlexTech Alliance – funded R&D project to expand the performance characteristics of printed, flexible Zn rechargeable batteries to a level applicable to flexible display, wireless and energy harvesting devices with high functionality.

Cal Poly to Analyze Screen Printing of Electronics Under an Award from FlexTech Alliance
Dec 4, 2012
FlexTech Alliance today announced an award to the Graphic Communication Dept. at the California Polytechnic State University at San Luis Obispo (Cal Poly) to explore the capabilities of screen printing electronics. The FlexTech Alliance funded study will investigate low viscosity inks to produce thin ink films and fine features. The knowledge gained will help printing industries understand and adopt printed electronics technologies.

Solar Cells on Flexible Glass Demonstrated by FlexTech Alliance Funded Project
Oct 25, 2012
Collaborative project among Corning, Binghamton University’s Center for Advanced Microelectronics Manufacturing (CAMM) and Western Michigan University’s Center for the Advancement of Printed Electronics (CAPE) shows feasibility of producing “smart” surfaces of the future on new ultra-thin flexible glass product

FlexTech Alliance Funded Project with Etched in Time, Inc., Yields Key Manufacturing System for Producing Flexible, Printed Electronics
Oct 17, 2012
FlexTech Alliance announced the completion of a development project with Etched in Time, Inc. (EITI), for a plasma etch system that is compatible with a wide array of roll-to-roll equipment. The result of the project is a tool that can be used in the manufacture of a broad range of products including LED lighting or solar panels fabricated on plastic substrates.

FlexTech Alliance Hosts Printed Electronics Metrology Status and Needs Workshop at NIST
Sep 24, 2012
Industry Gathering Produces Approaches to Advance Manufacturing Strategies

The purpose of the workshop was to examine current requirements and identify future needs for flexible, printed electronics (FPE) manufacturing. Insights from both the integrated circuit (IC) and flat panel display (FPD) industries were presented.

FlexTech Alliance Workshop on Ink and Substrate Interactions Addresses Unique Challenges of Printing Electronics Across a Wide Spectrum of Materials and Devices
Sep 1, 2012
FlexTech Alliance hosted a workshop focused on ink and substrate interactions on August 1-2, 2012 at Western Michigan University’s Center for the Advancement of Printed Electronics. The workshop examined the unique challenges of printing electronics on paper, plastic, glass, textiles, foil and other substrates.

FlexTech Alliance Funds Multi-Partner Project to Build an Integrated, Printed Memory and Sensor System
Aug 21, 2012
Technology from PARC, Thinfilm Electronics and University of California at Berkeley Establish Foundation for Low Cost Medical, Pharmaceutical and Food Supply Monitoring

FlexTech Alliance Opens 2013 Flexible Electronics & Displays Conference Call for Papers
Aug 9, 2012
12th Annual Event Broadens Scope of Topics, Emphasizes Product Applications

The conference is a culmination of shared information, highlighting technical breakthroughs and demonstrating working products in flexible, printed electronics and displays. In addition to product demos and new applications, priority for paper selection will be given to original research and new toolset, process and materials introductions.

Product Designers are Key to Next Phase of Flexible Electronics Say Panel of Experts at FlexTech Alliance Workshop On Metal Oxide Thin Film Transistors
Aug 7, 2012
It was standing room only at the one-day workshop “Metal Oxide TFT Devices and Technology” organized by the FlexTech Alliance on July 11, 2012, in partnership with SEMI. Subject matter experts from different sectors, including, manufacturing equipment and materials giants Applied Materials and Eastman Kodak; display companies like Sharp Labs and CBRITE; development groups from PARC and Cambridge NanoTech; and, research university contingents from Oregon State, Arizona State and Penn State, reported on developments.

Performance Benchmarks for Full Scale Production of Printed Electronics Attained from FlexTech Alliance Funded Project with Clemson University
Jul 16, 2012
FlexTech Alliance announced the completion of a research project with Clemson University for benchmarking printing processes in roll-to-roll manufacturing of printed electronics components. The FlexTech Alliance funded study is an important first step in understanding conductive printed features fabricated using full-scale printing presses as opposed to laboratory scale equipment.

FlexTech Alliance Funded Project with Polyera Produces Printable, High-Performance Electronic Devices
Jul 12, 2012
FlexTech Alliance announced the successful completion of a project with Polyera Corporation to develop printable n-type organic semiconductors. The project was chosen to receive FlexTech Alliance funding of $.3M with the goal of developing materials that can be printed on flexible, lightweight substrates, enabling the manufacture of electronics with novel form factors such as roll-up displays and flexible solar panels.

FlexTech Alliance Announces Dates and Location of 2013 Flexible Electronics & Displays Conference & Exhibition
Jun 27, 2012
New metropolitan venue, expanded advisory board reflect conference and industry growth

The conference, now in its 12th year, is moving to the Phoenix, Arizona Convention Center to accommodate its continuous growth. The new venue will provide technologically advanced amenities in a vibrant downtown location, while maintaining the superb networking atmosphere that has long characterized the Flex Conference.