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FlexTech Events
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Dates |
Event |
Location |
Sponsor |
| Jun. 26 |
Smart Windows Webinar |
Webinar |
FlexTech Alliance |
| Jul. 10 |
Emerging Materials and Processes for Transparent Conductors |
SEMICON WEST, San Francisco, CA |
FUJIFILM Dimatix, Inc. |
| Jul. 11 |
The Role of Conventional Si ICs in Flexible Electronics |
SEMICON WEST, San Francisco, CA |
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| Aug. 6-7 |
Building Electronics on Paper - Why, How & Who |
Kalamazoo, MI |
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| Sep. 8-12 |
Print 13 |
Chicago, IL |
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| Feb. 3-6, 2014 |
2014 Flex Conference |
Phoenix, AZ |
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 Workshop: "Printed and Flexible Electronics Technology for Health, Safety and BioSensor Applications "
Date: April 16-17, 2013
FlexTech Alliance Headquarters
San Jose, CA
Register Now
This workshop will examine the growing interest in flexible electronics for biosensor applications from medical sensors and biomarkers to smart fabrics. The requirements and challenges for these products will be discussed. The technology of printed electronics and Hybrid Solutions in these products will be presented along with the critical new manufacturing techniques including roll to roll and self assembly solutions. This may include new sensor, battery and interconnect technology etc. that allows a low cost product to be produced.
PREVIOUS WORKSHOPS
Workshop: "Printed Electronics Metrology - The Status and Needs"
Date: September 12-13, 2012
National Institute of Standards and Technology
Click here for workshop proceedings.
FlexTech Alliance hosted a metrology workshop on September 12-13, 2013 at the National Institute of Standards and Technology (NIST) in Gaithersburg, MD. The purpose of the workshop was to examine current requirements and identify future needs for flexible, printed electronics (FPE) manufacturing. Insights from both the integrated circuit (IC) and flat panel display (FPD) industries were presented.
Corning, Orbotech and Imprint Energy reviewed the challenges of obtaining measurements on a flexible substrate, such as plastic or flexible glass. These specifically relate to the differences in material characteristics including mechanical reliability, thermal effects such as expansion and contraction, and processing on a fast moving web as opposed to plate to plate or wafer to wafer.
Speakers from Northfield Automation, JA Woollam, NVision, and DarkField Technologies related various, current methods to perform FPE metrology functions and the pros and cons of each.
Jay Provine of Stanford University, who is working in the field of atomic layer deposition (ALD), reviewed several types of measuring techniques for thin films. He concluded that these methods offer insight in different ways and, taken together, provide a more complete measurement picture. However, the time and cost of multiple techniques have to be considered.
  
Workshop: "Printing Electronics: Ink/Substrate Interactions"
Date: August 1-2, 2012
Kalamazoo, MI
Click here for workshop proceedings.
The workshop, held at Western Michigan University’s Center for the Advancement of Printed Electronics (CAPE), examined the unique challenges of printing electronics on paper, plastic, glass, textiles, foil and other substrates. Perspectives from material suppliers, equipment manufacturers, and university research labs were presented.
Experts from the University of Texas at Dallas and Arizona State University discussed the challenges of printing electronics on textiles. That was followed by a presentation by Dr. Nackbong Choi, Lehigh University, on flexible, printable electronics on metal foil substrates with offset roll printing technology.
The afternoon session reported on current manufacturing capabilities and trends. Kevin Manes of Mark Andy began with a practical, hands-on discussion of current roll-to-roll printing equipment and the intricacies of the process tools. Next, Tim Luong of FUJIFILM Dimatix examined in detail inkjet printhead deposition technology. Bob Praino of Chasm Technologies delivered a tutorial on the printing and coating ecosystem.
The workshop concluded with presentations focused on printing devices: Dania Alsaid of CAPE (capacitors), UC Berkeley (high performance printed transistors), PARC (printed field-effect transistors) and HP (paper-based devices, sensors and MEMS).
  
Workshop: "Metal Oxide TFT Devices and Technology"
Date: July 11, 2012
San Francisco, CA
Click here for workshop proceedings.
Display backplanes fabricated with silicon TFTs have been the industry standard for displays of all kinds. However there is now a very rapid rise in the metal oxide TFT market driven by the promise of much lower manufacturing costs and electron mobilities suitable for driving OLEDs as well as LCDs. The low process temperature enables metal oxide TFTs to be deposited on plastic substrates and make them ideally suited for flexible displays, sensors and RFIDs.
As well as lower manufacturing costs, experts believe the technology could be the key to power consumption reduction, higher refresh rates and a variety of other capabilities sought after by the industry.
It is estimated that the metal oxide TFTs market could reach $2.1 billion by 2017.
Presentations included speakers from Sharp, CBrite, Eastman Kodak, Cambridge NanoTech, PARC, Applied Materials, University of Oregon.
Workshop:
"The Road to Flexible, Wearable Electronics for Biometrics and Medicine"
Date: April 10-11, 2012
Click here for workshop proceedings.
The first workshop of 2012 focused on wearable electronics for biometrics and medicine. Representative markets included athletic, fitness & apparel, consumer devices, defense and first responder, and medical.
Subject matter experts from HP, MC10, Shimmer Research, Body Media, Avery Dennison and others shared their insights on sensors, substrates, materials, electronics, packaging, design and interfaces that will enable data capture, storage, (wireless) transmission and display.
Webinar: FlexTech Alliance and NanoMarkets presented
"The Market for Flexible Photovoltaics"
Date: December 6, 2011
In this webinar, Lawrence Gasman discussed the new business opportunities that are emerging in flexible photovoltaics. Covering both inorganic thin-film PV, organic and dye sensitive cell (DSC) PV, this webinar began with an analysis of where the opportunities are to be found in building-integrated PV (BIPV), R2R manufacturing and battery charging sectors in particular.
Webinar: FlexTech Alliance and Lux Research presented
"Printed Electronics State of the Market: Next-Generation Printed, Organic, and Flexible Display Technologies"
Date: November 16, 2011
This webinar evaluated the potential for disruption amongst flexible display frontplane, backplane, and transparent conductor technologies.
Which are poised to make an impact?
Which will fail to live up to the hype?
FlexTech Alliance Quarterly Workshop on Hybrid Nanocomposites and Interfaces for Printed Electronics
Date: September 13th and 14th, 2011
Location: Georgia Tech., Atlanta, GA
FlexTech Alliance Quarterly Workshop on Transparent Conductors
Date: August 17th and 18th, 2011
Wednesday August 17 - Facility tour of Cambrios Technology Corp.
Thursday August 18 - Workshop and panel discussion
Location: FlexTech Alliance Headquarters, San Jose, CA
Webinar: New Opportunities in the Transparent Conductor Market
Another Successful Workshop!
FlexTech Alliance's Quarterly Flexible, Printed Electronics Workshop:
" How do we get from today’s flexible electronics technology to tomorrow’s high performance sensors?" November 9 - 10, 2010 in San Jose, CA.
See highlights
FlexTech Alliance's Quarterly Flexible, Printed Electronics Workshop
"Advanced Materials and Processes Enabling Thin Film PV R2R Nanomanufacturing"
September 16th 2010 in New Bedford, MA. Hosted by Konarka.
See highlights.
MarketWatch coverage of FlexTech Alliance’s
“Flexible and Printed Electronics: Product and Supply Chain Innovation.What’s now and what’s next for the manufacturing of flexible displays, lighting and photovoltaic products?”
a printed/flexible electronics segment presented for Extreme Electronics at SEMICON West 2010.
Click here to watch the video!
FlexTech Alliance's Quarterly Flexible, Printed Electronics Workshop Summary
"Re-Defining the Customer Experience:
Flexible and Printed Electronics for Smart Packaging"
June, 2010 - hosted by MeadWestvaco
FlexTech Alliance's Flexible Electronics & Displays Conference:
Customers, Creativity and Convergence Are The Major Themes Of 9th Annual Flexible Electronics And Displays Conference.
Click Here to view the slideshow from FlexTech Alliance's 2010 Flexible Electronics & Displays Conference!
FlexTech's Quarterly, Flexible, Printed Electronics Workshop Summary
October, 2009 - hosted by SEMI, CA
FlexTech's Quarterly, Flexible, Printed Electronics Workshop Summary
August, 2009 - hosted by Binghamton University, NY
Presentation
by FlexTech Alliance to the National Academy of Sciences
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